a3Di has been designed to meet the demanding requirements of 3D PCB inspection, offering a cost-effective, robust alternative to traditional 3d AOI inspection systems. Using a laser-based measurement technology to profile components and solder joints in true 3D, a3Di produces millions of measurements that can be directly compared and tested against a 3D model, generated from CAD. From PCB design information to production implementation, a3Di can be used in minutes rather than days.
​
a3Di is an automated metrology machine, applying measurement techniques to loaded PCB inspection and therefore is not affected by colour, lighting and part board warp. The results generated are pure measurements in X, Y and Z with limits that can conform to IPC 610 class 1,2 & 3 standards. The results are ideally suited to feed SPC systems, providing real-time information to control and improve your process.
Unlike systems that employ correction based algorithms, a3Di is an actual measurement-based system which provides an extremely low false call rate and offers significantly more process fault coverage than traditional AOI systems. 

We have highlighted some of the technical specifications of the system below, please contact us  for further technical details:

Hardware specifications & options

Conveyer based versions
2 or 3 stage high speed handler/conveyor
maximum PCB size 570 x 570mm
manual or auto width adjust options
NI cRIO controller
 
Drawer based versions
manually operated single or twin drawer hander
 
X-Y linear robot
0.1um resolution, 1um repeatability.
temperature compensation
optional rotation stage
easy maintenance design
 
Dual sensor
600 x 12mm (7,200 mm2 /second) inspection speed
optional additional sensors
 
High performance Windows based PC

Hardware options
  • UPS
  • integrated barcode readers
  • ionisation fans
  • hot swap disk drives
  • CE marked
  • 110Vac or 240Vac versions
  • ESD protection
  • light tower
  • USB ports
  • LAN ports

Software specifications & options

High-speed automatic programming from CAD
includes panel adjust software.
Supports:
ODB++
GenCad
 
On-the-fly calibration with temperature compensation board warp measurement and compensation
 
Software analysis options
  • MCR (Measured Character Recognition)
  • BGA ball height measurement (patented)
  • SPC
  • FOD (Foreign Object Detection)
 
Software development options
  • diagnostic station software option with LAN link and 3D fault viewer
  • off-line programming station with hardware simulation